AINewsBreaks – Nightfood Holdings Inc. (OTCQB: NGTF) Targets AI Semiconductor Packaging Opportunity Through TechForce Robotics

Nightfood Holdings (OTCQB: NGTF), operating as TechForce Robotics, is targeting the growing semiconductor automation and advanced-packaging market through its majority-owned TechForce Advanced Manufacturing subsidiary. The venture plans to scale production of automated Wafer Sorter and Automated Optical Inspection systems for 8-inch and 12-inch silicon wafers, with first production and revenue targeted for the fourth quarter of 2026.

The editorial also highlights Applied Materials (NASDAQ: AMAT), which is partnering with the University of California, Berkeley on semiconductor research; KLA (NASDAQ: KLAC), which opened a new R&D and Innovation Hub in India; Lam Research (NASDAQ: LRCX), which broke ground on a new Oregon lab as part of a planned investment of more than $3 billion in its global lab network; and Applied Optoelectronics (NASDAQ: AAOI), which received a new volume order for 800G data center transceivers from a major hyperscale customer.

To view the full press release, visit https://ibn.fm/il2jP

About Nightfood Holdings, Inc. (d/b/a TechForce Robotics)

Nightfood Holdings, Inc., doing business as TechForce Robotics, is an advanced robotics and automation company focused on delivering intelligent, scalable solutions for industrial and commercial applications. The Company integrates robotics, artificial intelligence and software-driven systems to optimize operations, improve efficiency and enable next-generation automation.

TechForce Robotics partners with organizations to design and deploy customized robotic solutions that address evolving operational requirements.

About TechForce Advanced Manufacturing

TechForce Advanced Manufacturing, Inc. is a Nevada corporation formed to develop, manufacture, commercialize, install and support semiconductor automation and inspection systems. Its initial focus is expanding Wafer Sorter and AOI production for wafer-based semiconductor and CoWoS-related advanced-packaging applications, while pursuing future applications supporting emerging Chip-on-Panel-on-Substrate (“CoPoS”) manufacturing process

NOTE TO INVESTORS: The latest news and updates relating to NGTF are available in the company’s newsroom at http://ibn.fm/NGTF

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