Nightfood Holdings (OTCQB: NGTF) is featured in a NetworkNewsAudio Audio Press Release (“APR”) titled “Inspection, Automation Equipment Could Be Overlooked Winners of the AI Buildout.” The audio release examines growing demand for advanced semiconductor inspection and automation equipment as artificial intelligence (“AI”) and high-performance computing drive increasingly complex chip packaging requirements. The editorial highlights industry participants KLA and Onto Innovation, whose inspection technologies address defect detection and quality control in advanced semiconductor manufacturing.
The editorial also examines Nightfood Holdings’ newly acquired technology, which includes designs and technical know-how for automated optical inspection machines used in chip-on-wafer-on-substrate (“CoWoS”) advanced packaging. The technology, associated with TechForce, targets a specialized equipment category tied to AI chip production. As semiconductor manufacturers increase production capacity, automated inspection systems are becoming an increasingly integral part of the manufacturing process, positioning specialized equipment providers to benefit from continued investment in AI infrastructure.
To view the full press release, visit https://ibn.fm/Zqq6M
About Nightfood Holdings, Inc. (d/b/a TechForce Robotics)
Nightfood Holdings, Inc., doing business as TechForce Robotics, is an advanced robotics and automation company focused on delivering intelligent, scalable solutions for industrial and commercial applications. The Company integrates robotics, artificial intelligence and software-driven systems to optimize operations, improve efficiency and enable next-generation automation.
TechForce Robotics partners with organizations to design and deploy customized robotic solutions that address evolving operational requirements.
About TechForce Advanced Manufacturing
TechForce Advanced Manufacturing, Inc. is a Nevada corporation formed to develop, manufacture, commercialize, install and support semiconductor automation and inspection systems. Its initial focus is expanding Wafer Sorter and AOI production for wafer-based semiconductor and CoWoS-related advanced-packaging applications, while pursuing future applications supporting emerging Chip-on-Panel-on-Substrate (“CoPoS”) manufacturing processes.
NOTE TO INVESTORS: The latest news and updates relating to NGTF are available in the company’s newsroom at http://ibn.fm/NGTF
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